Job description 岗位描述
1. Design ＆ develop sensor electronic hardware modules.
设计研发传感器电子硬件模块。
2. Create HW module specification per customer and system requirements.
根据不同的客户撰写相应的硬件模块规格书和系统要求。
3. Optimize hardware architecture with existing development standards and design guidelines. Design new circuit for new hardware architecture.
根据既有的开发标准和设计准则优化硬件架构；完成基于新硬件架构的电路设计。
4. Design ＆ work out electronic circuit with development tools.
使用开发工具设计电路图。
5. Analyses, simulate and optimize electronic circuit according to existing HW architecture.
根据既有的硬件架构分析、仿真和优化电路。
6. Define material and components with consideration of economic, qualitative and technological aspects in a project group.
对于项目所用到的物料和器件，根据成本、质量和技术要求进行选型。
7. Create HW related documents per hardware development process （like BOM, circuit diagram, WCCPA, FMEA, WCCA）.
根据硬件开发流程，在不同的阶段撰写相应的硬件文档（例如：BOM，电路图，WCCPA，FMEA, Worse case calculation）。
8. Perform defined hardware development reviews through the full hardware development process and release documents.
在整个硬件开发流程中完成规定的开发审核工作，发布相关文档；
9. Control Resource, schedule and cost in the project HW activities.
项目开发中硬件相关工作的进度及成本控制；
10. Support acquisitions for technical discussions.
对项目报价提供技术支持。
11. Regular exchange with other hardware development centers to support a global organizational structure.
与全球组织架构中的其他研发中心维持日常交流。
12. Other job assigned by Department Manager
部门经理安排的其他工作
Necessary requirements 任职资格
1. Good understand and experienced with hardware development process.
能够很好的理解硬件开发流程，具有一定的相关经验；
2. Strong background ＆ knowledge on electronic engineering, basic automotive background is needed, standalone working sprit from beginning requirements to end customer return analysis （whole products life cycle）.
在电子工程领域具有坚实的知识，具有基本的汽车行业知识，能够独立完成整个产品周期中从制定要求到分析客户反馈的工作；
3. Master to use HW development tools and simulation tool （such as Cadence, MathCAD, ICAPS, MicroCap, oscillograph）.
精通硬件开发工具以及模拟工具的使用（比如Cadence，MathCAD，ICAPS，示波器，MicroCap）。
4. Has 5 years working experience or above, with major in electronic or relevant.
具有5年或以上相关经验，电子工程相关专业。
5. Be familiar with HW module testing standards.
熟悉硬件模块的测试标准。
6. Good communication skill, capability to coordinate development activities of each location.
具有良好的沟通技巧，能够在开发工作上对每个团队进行协调。
7. Good verbal English will be helpful.
英文口语流利优先考虑。